The government aims to enhance packaging technologies in the semiconductor industry, shifting from back-end, labour-intensive work to high-end technical roles.

Science, Technology, and Innovation Minister Chang Lih Kang said the government will partner with five local semiconductor firms to establish the Advanced Packaging Consortium.

Other stakeholders include academic experts from the Academy of Sciences Malaysia (ASM) and Malaysia’s Applied Research and Development Centre (Mimos).

The minister noted that Malaysia’s semiconductor industry...